Description
🔧 Bond Beyond Limits with EPO-TEK!
- UNMATCHED THERMAL RESILIENCE - With a degradation temperature of 412°C, this epoxy withstands the heat like a pro.
- EXCEPTIONAL ADHESION STRENGTH - Experience superior bonding with lap shear strength exceeding 2,000 psi.
- LONG SHELF LIFE FOR CONVENIENCE - Store with confidence; this epoxy maintains its integrity for a full year at room temperature.
- PRECISION MIXING FOR OPTIMAL PERFORMANCE - Achieve perfect results with a precise 10:1 mix ratio, ensuring reliability in every application.
- VERSATILE APPLICATIONS ACROSS INDUSTRIES - Ideal for semiconductor, optic fiber, and electronics, making it the go-to choice for professionals.
EPO-TEK 353ND is a high-performance, two-part epoxy resin kit designed for demanding applications in semiconductor, optic fiber, and electronic industries. With a recommended cure temperature of 150°C and a pot life of up to 3 hours, this epoxy offers exceptional thermal stability, low outgassing, and impressive adhesion properties, making it a reliable choice for wafer bonding, MEM devices, and more.
