Essmetuin Alloy With 176℉(80℃) Melting Point For Quick Removal Chip Kit, SMD, QFP, PLCC,SOIC, Easily Used For Disassembling Components IC Without A Hot Air Station or Hot Air Station (0.9oz)

Description

🔥 Melt Smart, Rework Faster – The Alloy Pros Trust!

Essmetuin Alloy is a specialized low-melting-point solder alloy (176℉/80℃) designed for quick, safe removal of delicate IC components like SMD, QFP, PLCC, and SOIC without the need for a hot air station. Its fast melting and smooth flow protect sensitive chips during rework, making it an essential tool for professional electronics repair and prototyping.