GENNEL G109 1.2oz 35g Thermal Glue, Thermal Conductive Adhesive, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET 3D Printer Chipset IC High Performance 1.5W/m-K

Description

Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively. Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries. It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius) Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!