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🔥 Keep Your Cool with Dow Corning 340!
Dow Corning 340 Silicone Heat Sink Compound is a 5oz (142g) thermal coupling grease designed for optimal heat dissipation in electrical devices and PCB assemblies. With a high dielectric strength of 210 V/mil and a thermal conductivity of 0.67 W/mK, this non-curing, non-flowing compound ensures reliable performance without the hassle of curing processes.
L**E
Satisfied customer
Satisfied customer
R**R
Dowsil 340 Heat Sink Compound - Reliable, But Not for High-Performance CPUs
This thermal compound is not ideal for computer CPUs—its thermal conductivity is barely above water at 0.67 W/mK, while even budget CPU pastes range from 1-2 W/mK. However, where it shines is stability. It won’t dry out like other compounds, making it a solid choice for voltage regulators, power transistors, and similar applications where reliability matters more than peak performance. Recommended with that caveat.
T**0
Works well
I had a large number of power resistors I needed to mount to a large metal plate for thermal control and this compound worked really well. I am getting dissipation through the plate better than I expected and the paste was easy to use and keep contained during the assembly process. I have been a big fan of some specialty Dow products over the years and this thermal paste delivered as I would expect!
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