Thermal Paste 3.2 W/mK 30ml, TG4040 Silicone-Type Putty, Thermal Gel Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

الوصف

Specification:Thermal Conductivity: 3.2±10%W/mKViscosity: 250±100Pa·sDensity: 3.25±5% g/cm³Operating Temperature: -50~180°CVolume Resistivity: 1x10^13Ohm-m*Syringe should be used with glue gunApplication:Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.Features:Silicone-type spacer with great long term reliabilityLower thermal resistance than thermal padsPhysical property between liquid and solid stateElimination of different gap between heat source and the heatsinkCan applied with dispenser Operating Manual: 1.Push the latch and insert the stick.2.Put the tube in and twist. 3.Close the cover.4.Take off the plug. Storage: Store in a cool, dry place away from direct sunlight.