Reliability and Failure of Electronic Materials and Devices

This book has the rare quality to be complete and essential. It helped me a lot on my job having found in it a lot of useful informations. I still use it as a reference on the need.Particularly, Chapter 11 (Characterization and failure analysis of material and devices) gives detailed explanations about the most commoms failure mechanisms and suggests a useful analysis procedures. Moreover a comprehensice list of possible analysis techniques are explained to the reader.This book is without any doubt a well done job!

This order was completed just fine. Delivery was prompt and it arrived in good condition. No complaints.

I have a filing cabinet full of papers on various aspects of materials reliabilty: solder stress calculations, mechanical behavior, diffusion, corrosion mechanisms, etc. Professor Ohring's book neatly summarizes all of that into one coherent text, covering topics such as electromigration, electrostatic discharge, solder mechanics, corrosion, semiconductor devices and more. But rather than touch on the practical aspects of these failure modes, as do several reliability books I already own, he delves into the underlying fundamental mechanisms involved, providing equations and explanations. This is why I consider Ohring's book a true textbook on the subject. The detailed explanations are valuable to me in that they provide a springboard from which to analyze more complex issues. For anyone involved with reliability of materials in electronics, I highly recommend this book. And one more thing: in some places Prof. Ohring writes with a refreshing informality. For example, he talks about defects and KILLER DEFECTS (his words and capitalization!). I just laughed when I saw that.

The book is an excellent summary on the topic and more! It provides excellent coverage of state-of-the-art production techniques and the influence of particular procedures and components on device reliability. I suppose that complete newcomers might find it sometimes difficult to understand the background of some contents due to the compact style. However they are rewarded with one of the most comprehensive and up-to-date texts I have ever seen on this subject. Moreover the reader is provided with many references for further in-depth reading. Considering the wealth of information the book provides the author did an excellent job in writing a well readable text.I would recommend it as a textbook as well as for the experienced scientist/researcher.

I was in need of a means of analysing likely failures of electronics equipment manufactured in the 1960s. This book walked me through the problems and showed how to analyse the likely failure rates.This saved a lot of searching and it was good to have all the data readily to hand in the one book.